MCQOPTIONS
Saved Bookmarks
MCQOPTIONS
This section includes 19 Mcqs, each offering curated multiple-choice questions to sharpen your Vlsi knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
Oxide breakdown occurs due to |
| A. | electrostatic charge |
| B. | threshold voltage |
| C. | voltage shift |
| D. | poor input/output pad circuitry |
| Answer» E. | |
| 2. |
Hot carrier injection causes |
| A. | threshold voltage shift |
| B. | transconductance degradation |
| C. | threshold voltage shift & transconductance degradation |
| D. | none of the mentioned |
| Answer» D. none of the mentioned | |
| 3. |
_____ of faults are easier to detect. |
| A. | 50% |
| B. | 60% |
| C. | 70% |
| D. | 80% |
| Answer» E. | |
| 4. |
Test pattern generation is assisted using |
| A. | automatic test pattern generator |
| B. | exhaustive pattern generator |
| C. | repeated pattern generator |
| D. | loop pattern generator |
| Answer» B. exhaustive pattern generator | |
| 5. |
______ of the area is dedicated for testability. |
| A. | 20% |
| B. | 10% |
| C. | 30% |
| D. | 25% |
| Answer» D. 25% | |
| 6. |
Circuit nodes cannot be probed for monitoring or excitation. |
| A. | true |
| B. | false |
| Answer» B. false | |
| 7. |
______OF_FAULTS_ARE_EASIER_TO_DETECT?$ |
| A. | 50% |
| B. | 60% |
| C. | 70% |
| D. | 80% |
| Answer» E. | |
| 8. |
Oxide breakdown occurs due to$ |
| A. | electrostatic charge |
| B. | threshold voltage |
| C. | voltage shift |
| D. | poor input/output pad circuitry |
| Answer» E. | |
| 9. |
Hot carrier injection causes$ |
| A. | threshold voltage shift |
| B. | transconductance degradation |
| C. | both of the mentioned |
| D. | none of the mentioned |
| Answer» D. none of the mentioned | |
| 10. |
Which model is used for pc board testing? |
| A. | stuck at |
| B. | stuck in |
| C. | stuck on |
| D. | stuck through |
| Answer» B. stuck in | |
| 11. |
Test pattern generation is assisted usin? |
| A. | automatic test pattern generator |
| B. | exhaustive pattern generator |
| C. | repeated pattern generator |
| D. | loop pattern generator |
| Answer» B. exhaustive pattern generator | |
| 12. |
What are the dominant faults in diffusion layers? |
| A. | short citcuit faults |
| B. | open circuit faults |
| C. | short and open circuit faults |
| D. | power supply faults |
| Answer» B. open circuit faults | |
| 13. |
After partitioning, number of vectors is given by |
| A. | 2<sup>(m+n)</sup> |
| B. | 2<sup>((m+n)/2)</sup> |
| C. | 2<sup>n </sup>+ 2<sup>m</sup> |
| D. | 2<sup>2</sup>(m+n) |
| Answer» D. 2<sup>2</sup>(m+n) | |
| 14. |
The number of test vectors for exhaustive testing is calculated by |
| A. | 2<sup>(m+n)</sup> |
| B. | 2<sup>((m+n)/2)</sup> |
| C. | 2<sup>(m-n)</sup> |
| D. | 2<sup>2(m+n)</sup> |
| Answer» B. 2<sup>((m+n)/2)</sup> | |
| 15. |
In prototype testing, the circuits are |
| A. | open circuited |
| B. | short circuited |
| C. | tested as a whole circuit |
| D. | programmed |
| Answer» B. short circuited | |
| 16. |
Partitioning into subsystems are done at |
| A. | design stage |
| B. | prototype stage |
| C. | testing stage |
| D. | fabrication stage |
| Answer» C. testing stage | |
| 17. |
______ of the area is dedicated for testability |
| A. | 20% |
| B. | 10% |
| C. | 30% |
| D. | 25% |
| Answer» D. 25% | |
| 18. |
The circuit should be tested at |
| A. | design level |
| B. | chip level |
| C. | transistor level |
| D. | switch level |
| Answer» C. transistor level | |
| 19. |
Circuit nodes cannot be probed for monotoring or excitation. |
| A. | true |
| B. | false |
| Answer» B. false | |