 
			 
			MCQOPTIONS
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				This section includes 14 Mcqs, each offering curated multiple-choice questions to sharpen your Vlsi knowledge and support exam preparation. Choose a topic below to get started.
| 1. | The standard unit of capacitance is defined as? | 
| A. | Capacitance of gate to channel of MOS transistor having W = L dimensions | 
| B. | Capacitance of gate to channel of n-MOS transistor having W = 3L dimensions | 
| C. | Capacitance of gate to channel of p-MOS transistor having 3W = L dimensions | 
| D. | Capacitance of gate to channel of n-MOS transistor having W = L dimensions and p-MOS having W=3L dimensions | 
| Answer» B. Capacitance of gate to channel of n-MOS transistor having W = 3L dimensions | |
| 2. | The value of standard unit of capacitance is? | 
| A. | 0.01pF | 
| B. | 0.0032pF | 
| C. | 0.0023pF | 
| D. | All of the mentioned | 
| Answer» E. | |
| 3. | The value of diffusion capacitance in pF x 10-4/ m2 in 2 m design is? | 
| A. | 1.75 | 
| B. | 4 | 
| C. | 8 | 
| D. | 16 | 
| Answer» D. 16 | |
| 4. | The active capacitance is also called as __________ | 
| A. | Parasitic capacitance | 
| B. | Interconnect capacitance | 
| C. | Junction capacitance | 
| D. | Diffusion capacitance | 
| Answer» E. | |
| 5. | The typical value of capacitance in pF x 10-4/ m2 for gate to channel in based design is? | 
| A. | 1 | 
| B. | 0.4 | 
| C. | 0.2 | 
| D. | 4 | 
| Answer» E. | |
| 6. | Zero bias depletion capacitance per unit length at sidewall junctions is given by, (Cj is the zero bias depletion capacitance per unit area). | 
| A. | ( 10).Cj.xj | 
| B. | ( 5).Cj.xj | 
| C. | ( 10).Cj.xj<sup>2</sup> | 
| D. | ( 10).Cj.xj<sup>3</sup> | 
| Answer» B. ( 5).Cj.xj | |
| 7. | By what amount is Sidewall doping larger than substrate doping concentration. | 
| A. | 5 | 
| B. | 2 | 
| C. | 1 | 
| D. | 10 | 
| Answer» E. | |
| 8. | The amount of gate oxide capacitance is determined by __________ | 
| A. | Charges present on the gate | 
| B. | Polarity of the gate | 
| C. | Charges present on the substrate | 
| D. | Area of the gate | 
| Answer» E. | |
| 9. | The interconnect capacitance is formed by __________ | 
| A. | Area between the interconnect lines | 
| B. | Interconnect lines between the gates | 
| C. | Inter electrode capacitance of interconnect lines | 
| D. | None of the mentioned | 
| Answer» C. Inter electrode capacitance of interconnect lines | |
| 10. | The total load capacitance is calculated as the sum of __________ | 
| A. | Drain capacitance in series with input capacitance | 
| B. | Drain capacitance + interconnect capacitance +input capacitance | 
| C. | Drain capacitance + interconnect capacitance input capacitance | 
| D. | Drain capacitance in parallel with input capacitance | 
| Answer» C. Drain capacitance + interconnect capacitance input capacitance | |
| 11. | The dominant component of the total output capacitance in submicron technology is? | 
| A. | Drain diffusion capacitance | 
| B. | Gate oxide capacitance | 
| C. | Interconnect capacitance | 
| D. | Junction parasitic capacitance | 
| Answer» D. Junction parasitic capacitance | |
| 12. | The amount of parasitic capacitance at the output node is determined by __________ | 
| A. | Concentration of the impurity doped | 
| B. | Size of the total drain diffusion area | 
| C. | Charges stored in the capacitor | 
| D. | None of the mentioned | 
| Answer» C. Charges stored in the capacitor | |
| 13. | The junction parasitic capacitance are produced due to ____________ | 
| A. | Source diffusion regions | 
| B. | Gate diffusion regions | 
| C. | Drain diffusion region | 
| D. | All of the mentioned | 
| Answer» D. All of the mentioned | |
| 14. | Which of the following mainly constitutes the output node capacitance? | 
| A. | Inter electrode capacitance | 
| B. | Stray capacitance | 
| C. | Junction Parasitic capacitance | 
| D. | All of the mentioned | 
| Answer» D. All of the mentioned | |