MCQOPTIONS
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MCQOPTIONS
This section includes 20 Mcqs, each offering curated multiple-choice questions to sharpen your Vlsi knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
The number of paths ___________ with number of gates. |
| A. | increases exponentially |
| B. | decreases exponentially |
| C. | remains the same |
| D. | increases rapidly |
| Answer» B. decreases exponentially | |
| 2. |
In PLA, extra crosspoint in AND-array leads to |
| A. | OR fault |
| B. | growth fault |
| C. | missing fault |
| D. | disappearance fault |
| Answer» E. | |
| 3. |
In PLA, missing cross point in OR-array leads to |
| A. | OR fault |
| B. | growth fault |
| C. | missing fault |
| D. | disappearance fault |
| Answer» E. | |
| 4. |
Data retention time comes under __________ fault. |
| A. | functional fault |
| B. | memory fault |
| C. | parametric fault |
| D. | structural fault |
| Answer» D. structural fault | |
| 5. |
For a n signal lines circuit _____________ bridging faults are possible. |
| A. | n |
| B. | 2n |
| C. | n2 |
| D. | n/2 |
| Answer» D. n/2 | |
| 6. |
For a circuit with k lines __________ single stuck-at fault is possible. |
| A. | k |
| B. | 2k |
| C. | k/2 |
| D. | k2 |
| Answer» C. k/2 | |
| 7. |
DATA_RETENTION_TIME_COMES_UNDER_______FAULT?$ |
| A. | functional fault |
| B. | memory fault |
| C. | parametric fault |
| D. | structural fault |
| Answer» D. structural fault | |
| 8. |
In PLA, extra crosspoint in AND-array leads to$ |
| A. | OR fault |
| B. | growth fault |
| C. | missing fault |
| D. | disapperance fault |
| Answer» E. | |
| 9. |
In PLA, missing cross point in OR-array leads to$ |
| A. | OR fault |
| B. | growth fault |
| C. | missing fault |
| D. | disapperance fault |
| Answer» E. | |
| 10. |
The quality of the test set is measured by |
| A. | fault margin |
| B. | fault detection |
| C. | fault correction |
| D. | fault coverage |
| Answer» E. | |
| 11. |
The number of paths ______ with number of gates |
| A. | increases exponentially |
| B. | decreases exponentially |
| C. | remains the same |
| D. | increases rapidly |
| Answer» B. decreases exponentially | |
| 12. |
Which fault causes output floating? |
| A. | stuck-open |
| B. | stuck-at |
| C. | stuck-on |
| D. | IDDQ |
| Answer» B. stuck-at | |
| 13. |
IDDQ fault occurs when there is |
| A. | increased voltage |
| B. | increased quiescent current |
| C. | increased power supply |
| D. | increased discharge |
| Answer» C. increased power supply | |
| 14. |
For a n signal lines circuit, ______ bridging faults are possible |
| A. | n |
| B. | 2n |
| C. | n<sup>2</sup> |
| D. | n/2 |
| Answer» D. n/2 | |
| 15. |
Single stuck-at fault is technology independent. |
| A. | true |
| B. | false |
| Answer» B. false | |
| 16. |
For a circuit with k lines, ____ single stuckat fault is possible |
| A. | k |
| B. | 2k |
| C. | k/2 |
| D. | k<sup>2</sup> |
| Answer» C. k/2 | |
| 17. |
Which relation is correct? |
| A. | failure – error – fault |
| B. | fault – error – failure |
| C. | error – fault – failure |
| D. | error – failure – fault |
| Answer» C. error ‚Äö√Ñ√∂‚àö√ë‚àö¬® fault ‚Äö√Ñ√∂‚àö√ë‚àö¬® failure | |
| 18. |
Electromigration is a |
| A. | processing fault |
| B. | material defects |
| C. | time dependent failure |
| D. | packaging fault |
| Answer» D. packaging fault | |
| 19. |
Surface impurities occurs due to ion migration. |
| A. | true |
| B. | false |
| Answer» B. false | |
| 20. |
Which are processing faults? |
| A. | missing contact window |
| B. | parasitic transistor |
| C. | oxide breakdown |
| D. | all of the mentioned |
| Answer» E. | |