MCQOPTIONS
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MCQOPTIONS
This section includes 28 Mcqs, each offering curated multiple-choice questions to sharpen your Vlsi knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
Which must be given the highest priority in design process? |
| A. | architecture |
| B. | communication |
| C. | colour |
| D. | thickness |
| Answer» C. colour | |
| 2. |
The bottom subfunction is called as |
| A. | lower function |
| B. | low cell |
| C. | leaf cell |
| D. | bottom cell |
| Answer» D. bottom cell | |
| 3. |
Two metal layers can be joined by using |
| A. | contact cut |
| B. | wire |
| C. | via |
| D. | glass |
| Answer» D. glass | |
| 4. |
When polysilicon crosses a diffusion __________ will be formed. |
| A. | via |
| B. | transistor |
| C. | switch |
| D. | short circuit |
| Answer» C. switch | |
| 5. |
Which approach is used to show the relative disposition of subunits? |
| A. | architectural block diagram |
| B. | stick diagram |
| C. | layout diagram |
| D. | floor plan |
| Answer» E. | |
| 6. |
VLSI design is done in _________ approach. |
| A. | top-down |
| B. | bottom-up |
| C. | random |
| D. | semi random |
| Answer» B. bottom-up | |
| 7. |
High level of system integration __________ interconnections. |
| A. | reduces |
| B. | increases |
| C. | does not affect |
| D. | doubles |
| Answer» B. increases | |
| 8. |
Microprocessor has __________ major architectural blocks. |
| A. | two |
| B. | three |
| C. | four |
| D. | five |
| Answer» D. five | |
| 9. |
TWO_METAL_LAYERS_CAN_BE_JOINED_BY_USING?$ |
| A. | contact cut |
| B. | wire |
| C. | via |
| D. | glass |
| Answer» D. glass | |
| 10. |
WHICH_OF_THESE_IS_SAID_TO_BE_TRUE_ABOUT_RESOLUTION_PROCESS_IN_GENERIC_SOFTWARE_ENGINEERING_DESIGN_PROCESS_??$ |
| A. | Architectural design is low resolution process |
| B. | Detailed design is high resolution process |
| C. | All of the mentioned |
| D. | None of the mentioned |
| Answer» E. | |
| 11. |
Which must be given the highest priority in design process?$ |
| A. | architecture |
| B. | communication |
| C. | colour |
| D. | thickness |
| Answer» C. colour | |
| 12. |
The bottom subfunction is called as$ |
| A. | lower function |
| B. | low cell |
| C. | leaf cell |
| D. | bottom cell |
| Answer» D. bottom cell | |
| 13. |
Which_step_among_these_follows_wrong_sequence_in_software_engineering_design_process?$ |
| A. | Analyze problem |
| B. | Generate candidate architecture |
| C. | Finalize design |
| D. | Select detailed design |
| Answer» D. Select detailed design | |
| 14. |
When a polysilicon crosses a diffusion _____ will be forme? |
| A. | via |
| B. | transistor |
| C. | switch |
| D. | short circuit |
| Answer» C. switch | |
| 15. |
Generic software engineering design process defined by which of these steps ? |
| A. | Generic software engineering design process first job after analysis is detailed design |
| B. | Attention is turned later to architectural design |
| C. | Architectural design is not followed by Detailed design |
| D. | All of the mentioned |
| Answer» E. | |
| 16. |
What is true about generic software product design process ? |
| A. | It begins with SRS |
| B. | It ends with Product Design Problem |
| C. | Analysis is done and end product is project mission statement |
| D. | None of the mentioned |
| Answer» E. | |
| 17. |
Approach used for design process are |
| A. | circuit symbols |
| B. | logic symbols |
| C. | stick diagrams |
| D. | all of the mentioned |
| Answer» E. | |
| 18. |
Why do you think iteration is important for design ? |
| A. | To frequently reanalyze the problem |
| B. | To generate and improve solutions only once for better output |
| C. | All of the mentioned |
| D. | None of the mentioned |
| Answer» B. To generate and improve solutions only once for better output | |
| 19. |
Components operating in high frequency should be |
| A. | far apart |
| B. | closely spaced |
| C. | randomly spaced |
| D. | can be placed in straight manner |
| Answer» C. randomly spaced | |
| 20. |
Which of these is not in sequence for generic design process ? |
| A. | Analyze the Problem |
| B. | Evaluate candidate solutions |
| C. | Finalize the Design |
| D. | None of the mentioned |
| Answer» C. Finalize the Design | |
| 21. |
VLSI design is done in ____ approach |
| A. | top-down |
| B. | bottom-up |
| C. | random |
| D. | semi random |
| Answer» B. bottom-up | |
| 22. |
Which of these is not in sequence for generic problem solving strategy ? |
| A. | Understand the problem |
| B. | Generate candidate solutions |
| C. | Iterate if no solution is adequate |
| D. | None of the mentioned |
| Answer» D. None of the mentioned | |
| 23. |
Performance is better if power speed product is |
| A. | low |
| B. | high |
| C. | very low |
| D. | very high |
| Answer» C. very low | |
| 24. |
Which of these are followed in case of software design process ? |
| A. | Analysis occurs at start of product design with a product idea |
| B. | Analysis occurs at the end of engineering design with the SRS |
| C. | Product design resolution produces the design document |
| D. | Engineering design resolution produces the SRS |
| Answer» B. Analysis occurs at the end of engineering design with the SRS | |
| 25. |
Some important features of system are |
| A. | lower weight |
| B. | lower volume |
| C. | lower power dissipation |
| D. | all of the mentioned |
| Answer» E. | |
| 26. |
Which of these is true ? |
| A. | Analysis – Solving problem |
| B. | Design – Understanding problem |
| C. | Analysis & Design |
| D. | None of the mentioned |
| Answer» E. | |
| 27. |
High level of system integration, _____ interconnections |
| A. | reduces |
| B. | increases |
| C. | does not affect |
| D. | doubles |
| Answer» B. increases | |
| 28. |
Micropocessor has ____ major architectural blocks |
| A. | two |
| B. | three |
| C. | four |
| D. | five |
| Answer» D. five | |