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This section includes 14 Mcqs, each offering curated multiple-choice questions to sharpen your Vlsi knowledge and support exam preparation. Choose a topic below to get started.
1. |
The standard unit of capacitance is defined as? |
A. | Capacitance of gate to channel of MOS transistor having W = L dimensions |
B. | Capacitance of gate to channel of n-MOS transistor having W = 3L dimensions |
C. | Capacitance of gate to channel of p-MOS transistor having 3W = L dimensions |
D. | Capacitance of gate to channel of n-MOS transistor having W = L dimensions and p-MOS having W=3L dimensions |
Answer» B. Capacitance of gate to channel of n-MOS transistor having W = 3L dimensions | |
2. |
The value of standard unit of capacitance is? |
A. | 0.01pF |
B. | 0.0032pF |
C. | 0.0023pF |
D. | All of the mentioned |
Answer» E. | |
3. |
The value of diffusion capacitance in pF x 10-4/ m2 in 2 m design is? |
A. | 1.75 |
B. | 4 |
C. | 8 |
D. | 16 |
Answer» D. 16 | |
4. |
The active capacitance is also called as __________ |
A. | Parasitic capacitance |
B. | Interconnect capacitance |
C. | Junction capacitance |
D. | Diffusion capacitance |
Answer» E. | |
5. |
The typical value of capacitance in pF x 10-4/ m2 for gate to channel in based design is? |
A. | 1 |
B. | 0.4 |
C. | 0.2 |
D. | 4 |
Answer» E. | |
6. |
Zero bias depletion capacitance per unit length at sidewall junctions is given by, (Cj is the zero bias depletion capacitance per unit area). |
A. | ( 10).Cj.xj |
B. | ( 5).Cj.xj |
C. | ( 10).Cj.xj<sup>2</sup> |
D. | ( 10).Cj.xj<sup>3</sup> |
Answer» B. ( 5).Cj.xj | |
7. |
By what amount is Sidewall doping larger than substrate doping concentration. |
A. | 5 |
B. | 2 |
C. | 1 |
D. | 10 |
Answer» E. | |
8. |
The amount of gate oxide capacitance is determined by __________ |
A. | Charges present on the gate |
B. | Polarity of the gate |
C. | Charges present on the substrate |
D. | Area of the gate |
Answer» E. | |
9. |
The interconnect capacitance is formed by __________ |
A. | Area between the interconnect lines |
B. | Interconnect lines between the gates |
C. | Inter electrode capacitance of interconnect lines |
D. | None of the mentioned |
Answer» C. Inter electrode capacitance of interconnect lines | |
10. |
The total load capacitance is calculated as the sum of __________ |
A. | Drain capacitance in series with input capacitance |
B. | Drain capacitance + interconnect capacitance +input capacitance |
C. | Drain capacitance + interconnect capacitance input capacitance |
D. | Drain capacitance in parallel with input capacitance |
Answer» C. Drain capacitance + interconnect capacitance input capacitance | |
11. |
The dominant component of the total output capacitance in submicron technology is? |
A. | Drain diffusion capacitance |
B. | Gate oxide capacitance |
C. | Interconnect capacitance |
D. | Junction parasitic capacitance |
Answer» D. Junction parasitic capacitance | |
12. |
The amount of parasitic capacitance at the output node is determined by __________ |
A. | Concentration of the impurity doped |
B. | Size of the total drain diffusion area |
C. | Charges stored in the capacitor |
D. | None of the mentioned |
Answer» C. Charges stored in the capacitor | |
13. |
The junction parasitic capacitance are produced due to ____________ |
A. | Source diffusion regions |
B. | Gate diffusion regions |
C. | Drain diffusion region |
D. | All of the mentioned |
Answer» D. All of the mentioned | |
14. |
Which of the following mainly constitutes the output node capacitance? |
A. | Inter electrode capacitance |
B. | Stray capacitance |
C. | Junction Parasitic capacitance |
D. | All of the mentioned |
Answer» D. All of the mentioned | |