

MCQOPTIONS
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This section includes 16 Mcqs, each offering curated multiple-choice questions to sharpen your Vlsi knowledge and support exam preparation. Choose a topic below to get started.
1. |
Pads must be placed generally in the periphery of the chip area. |
A. | true |
B. | false |
Answer» B. false | |
2. |
Buffers are needed to drive |
A. | small capacitance |
B. | large capacitance |
C. | small resistance |
D. | large resistance |
Answer» C. small resistance | |
3. |
Which occupies lesser area? |
A. | Vdd pads |
B. | Vss pads |
C. | input pads |
D. | output pads |
Answer» E. | |
4. |
WHICH_OCCUPIES_LESSER_AREA??$ |
A. | Vdd pads |
B. | Vss pads |
C. | input pads |
D. | output pads |
Answer» E. | |
5. |
Pads must be placed generally in the periphery of the chip area.$ |
A. | true |
B. | false |
Answer» B. false | |
6. |
Buffers are needed to drive$ |
A. | small capacitance |
B. | large capacitance |
C. | small resistance |
D. | large resistance |
Answer» C. small resistance | |
7. |
How much area should be allocated for pads? |
A. | one third |
B. | two third |
C. | half |
D. | three fourth |
Answer» B. two third | |
8. |
Which pad contains Schmitt trigger circuitry? |
A. | Vdd pads |
B. | Vss pads |
C. | input pads |
D. | output pads |
Answer» D. output pads | |
9. |
Bonding pads are placed |
A. | in the chip |
B. | exactly at the centre of chip |
C. | edge of the chip |
D. | above the chip |
Answer» D. above the chip | |
10. |
Input and output pads are made up of |
A. | polysilicon |
B. | metal |
C. | silicon |
D. | carbon |
Answer» C. silicon | |
11. |
Rifts are used for smooth flow through buses. |
A. | true |
B. | false |
Answer» B. false | |
12. |
Rifts and extensions should be placed in |
A. | minimum amount of geometry |
B. | maximum amount of geometry |
C. | in slopes |
D. | anywhere in the layout |
Answer» B. maximum amount of geometry | |
13. |
Extensions are |
A. | vertical |
B. | horizontal |
C. | diagonal |
D. | happazard |
Answer» C. diagonal | |
14. |
The IN and OUT bus lines should be in |
A. | metal |
B. | polysilicon |
C. | diffusion |
D. | silicon |
Answer» B. polysilicon | |
15. |
The IN and OUT bus lines relative positions are interchanged to |
A. | match height |
B. | match length |
C. | match width |
D. | match thickness |
Answer» B. match length | |
16. |
A 4-bit processor has two buses which are |
A. | unidirectional |
B. | bidirectional |
C. | one unidirectional and one bidirectional |
D. | more than two buses |
Answer» D. more than two buses | |