

MCQOPTIONS
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This section includes 11 Mcqs, each offering curated multiple-choice questions to sharpen your Vlsi knowledge and support exam preparation. Choose a topic below to get started.
1. |
Contact cuts should be ____ apart. |
A. | 2 |
B. | 3 |
C. | 4 |
D. | |
Answer» B. 3 | |
2. |
Minimum diffusion space is __________ |
A. | 2 |
B. | 3 |
C. | 4 |
D. | |
Answer» C. 4 | |
3. |
What are the advantages of design rules? |
A. | durable |
B. | scalable |
C. | portable |
D. | all of the mentioned |
Answer» E. | |
4. |
Which can bring about variations in threshold voltage? |
A. | oxide thickness |
B. | ion implantation |
C. | poly variations |
D. | all of the mentioned |
Answer» E. | |
5. |
The minimum spacing between two n-well is _____ micro meter. |
A. | 4 |
B. | 5 |
C. | 8 |
D. | 8.5 |
Answer» E. | |
6. |
Minimum n-well width should be ____________ micro meter. |
A. | 2 |
B. | 3 |
C. | 4 |
D. | 6 |
Answer» C. 4 | |
7. |
Hatching is compatible with __________ |
A. | monochrome encoding |
B. | bicode encoding |
C. | tricode encoding |
D. | not compatible with any encoding |
Answer» B. bicode encoding | |
8. |
Minimum feature size for thick oxide is? |
A. | 2 |
B. | 3 |
C. | 4 |
D. | |
Answer» C. 4 | |
9. |
The oxide layer below the first metal layer is deposited using __________ |
A. | diffusion method |
B. | chemical vapour deposition |
C. | solid deposition |
D. | scattering method |
Answer» C. solid deposition | |
10. |
Which is a more complex process? |
A. | buried contact |
B. | butting contact |
C. | buried & butting contact |
D. | none of the mentioned |
Answer» B. butting contact | |
11. |
Diffusion and polysilicon layers are connected together using __________ |
A. | butting contact |
B. | buried contact |
C. | separate contact |
D. | cannot be connected |
Answer» B. buried contact | |