MCQOPTIONS
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MCQOPTIONS
This section includes 10 Mcqs, each offering curated multiple-choice questions to sharpen your Linear Integrated Circuit knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
WHAT_IS_THE_ADVANTAGE_OF_USING_SURFACE_MOUNT_TECHNOLOGY??$ |
| A. | All of the mentioned |
| B. | Low power consumption |
| C. | Reduces heat dissipation in components |
| D. | Use leaded or leadless components |
| Answer» E. | |
| 2. |
An ancient process used till today for production of circuit films is? |
| A. | Silk Screening technique |
| B. | Surface Mount Technology |
| C. | Ceramic Printing technique |
| D. | Screen Printing technique |
| Answer» E. | |
| 3. |
Which of the following process is involve in thick film technolog? |
| A. | Screen printing |
| B. | Ceramic firing |
| C. | Silk screening |
| D. | All of the mentioned |
| Answer» D. All of the mentioned | |
| 4. |
Electroplating technique is suitable for |
| A. | Making conduction films ceramic |
| B. | Coating with considerable thickness |
| C. | Coating without use of electric current |
| D. | Making conduction films of gold or copper |
| Answer» E. | |
| 5. |
Which process is used to deposit metals on glass, ceramic and plastic? |
| A. | Silk plating technique |
| B. | Gas plating technique |
| C. | Electroless plating technique |
| D. | Electroplating technique |
| Answer» D. Electroplating technique | |
| 6. |
How a uniform film with good crystal structure is attained in cathode sputtering process? |
| A. | By hitting high energy particle directly on the substrate |
| B. | Allowing Less time for the particles to deposit on the substrate |
| C. | High energy particle diffuse through low pressure gas and deposits on the substrate |
| D. | Heavy inert gas is used for film deposition on the substrate |
| Answer» D. Heavy inert gas is used for film deposition on the substrate | |
| 7. |
How is the process of film deposition carried out in cathode sputtering? |
| A. | Slower than evaporation method |
| B. | Faster than evaporation method |
| C. | Similar to same as evaporation method |
| D. | All of the mentioned |
| Answer» B. Faster than evaporation method | |
| 8. |
Which technology is used to get cheap resistors and capacitors? |
| A. | Thick film technology |
| B. | Thin film technology |
| C. | Thin and thick film technology |
| D. | None of the mentioned |
| Answer» C. Thin and thick film technology | |
| 9. |
Give the thickness range of the film used in thin film technology |
| A. | 0.5-2.5 mils |
| B. | 0.02-8 mils |
| C. | 10-20 mils |
| D. | 0.05-0.0 7mils |
| Answer» C. 10-20 mils | |
| 10. |
When does an integrated circuit exhibit greater degree of freedom and electrical performance? |
| A. | In thin and thick film technology |
| B. | In semiconductor technology |
| C. | In semiconductor and films technology |
| D. | In thick film technology only |
| Answer» D. In thick film technology only | |