Explore topic-wise MCQs in Advanced Machining.

This section includes 2460 Mcqs, each offering curated multiple-choice questions to sharpen your Advanced Machining knowledge and support exam preparation. Choose a topic below to get started.

701.

The short circuit load losses is/are ______________

A. direct load loss and stray load losses
B. direct load loss
C. stray load losses
D. field current loss
Answer» B. direct load loss
702.

What is the value of work done for the following arrangement? If, m1 = Mass of refrigerant passing through the evaporatorm2 = Mass of refrigerant passing through condenserm3 = Mass of vapor refrigerant formed in the flash chamber

A. m1 (h2 – h1) + m2 (h4 – h3)
B. m1 (h2 – h1) + m2 (h5 – h4)
C. (h8 – hf10) / (h9 – hf10)
D. (h1 – hf10) / (h4 – h9)View Answer
Answer» C. (h8 – hf10) / (h9 – hf10)
703.

What is the ratio of m3 / m2 for the following arrangement? If, m1 = Mass of refrigerant passing through the evaporatorm2 = Mass of refrigerant passing through condenserm3 = Mass of vapor refrigerant formed in the flash chamber

A. (h1 – hf6) / (h2 – h1) – (h4 – h3)
B. (h1 – hf6) / (h2 – h1) + (h4 – h3)
C. (h8 – hf10) / (h9 – hf10)
D. (h1 – hf10) / (h4 – h9)View Answer
Answer» D. (h1 – hf10) / (h4 – h9)View Answer
704.

What do process 8-9 and 8-10 represent?

A. Expansion
B. Separating the vapor and liquid form of refrigerant
C. Compression
D. Sub-cooling
Answer» C. Compression
705.

What does process 7-8 and 10-11 represent?

A. Expansion
B. Compression
C. Mixing of refrigerant coming from the flash chamber
D. Sub-cooling
Answer» B. Compression
706.

What does process 6-7 represent?

A. Evaporation
B. Compression
C. Mixing of refrigerant coming from the flash chamber
D. Sub-cooling
Answer» E.
707.

What does process 3-4 represent?

A. Evaporation
B. Compression
C. Mixing of refrigerant coming from the flash chamber
D. Condensation
Answer» D. Condensation
708.

What do PC, PE, and PF represent?

A. Evaporator, expansion and flash chamber pressure
B. Compression, expansion and flash chamber pressure
C. Condenser, evaporator and flash chamber pressure
D. Intercooling pressure
Answer» D. Intercooling pressure
709.

What does process 2-3 represent?

A. Evaporation
B. Compression
C. Intercooling
D. Condensation
Answer» D. Condensation
710.

What does process 1-2 and 4-5 represent?

A. Evaporation
B. Compression
C. Condensation
D. Expansion
Answer» C. Condensation
711.

What is the purpose of using a flash chamber?

A. To increase pressure
B. To decrease pressure
C. To separate vapor and liquid refrigerant
D. To evaporate refrigerant partially
Answer» D. To evaporate refrigerant partially
712.

What is the purpose of using liquid sub-cooler?

A. To increase the cost of the compressor
B. To reduce the volumetric efficiency
C. To re-heat superheated refrigerant
D. To increase the refrigeration effect
Answer» E.
713.

What is the purpose of using intercooler?

A. To increase the cost of the compressor
B. To cool the superheated refrigerant
C. To re-heat superheated refrigerant
D. To reduce the volumetric efficiency
Answer» C. To re-heat superheated refrigerant
714.

Why is multi-stage or compound VCR with water intercooler, liquid sub-cooler, and the flash chamber used?

A. To improve C.O.P.
B. To decrease the refrigeration effect
C. To increase work
D. To increase leakage loss
Answer» B. To decrease the refrigeration effect
715.

Fibrous fillers have a high capacity for absorbing energy because of their ____________

A. Shape
B. Size
C. Composition
D. Surface area
Answer» B. Size
716.

In photo-extinction method, a source of light is directed through a suspension of ____________

A. Kerosene in cement
B. Cement in kerosene
C. Cement in water
D. Water in cement
Answer» C. Cement in water
717.

Adsorption method for measurement of total surface area involves the evaluation of quantity of ____________

A. Helium gas
B. Oxygen gas
C. Nitrogen gas
D. Argon gas
Answer» D. Argon gas
718.

The current generated in photoelectric cell represents the measure of the ____________

A. Turbidity
B. Adhesivity
C. Cohesivity
D. Viscosity
Answer» B. Adhesivity
719.

Sedimentation techniques are particularly useful for the particle size ranging from ____________

A. 50-10 µm
B. 40-2 µm
C. 100-50 µm
D. 80-40µm
Answer» C. 100-50 µm
720.

The instrument used for the examination of particle size ≥ 0.5 micron is ____________

A. Microscope
B. Electron microscope
C. Telescope
D. All of the mentioned
Answer» B. Electron microscope
721.

The minimum size of particle which can be separated through sieve analysis is ____________

A. 75 microns
B. 100 microns
C. 44 microns
D. 20 microns
Answer» D. 20 microns
722.

Which of the following is a method of particle size measurement?

A. Sieve analysis
B. Microscopic examination
C. Sedimentation analysis
D. All of the mentioned
Answer» E.
723.

Which property of polymer is enhanced by adding antimony oxychloride as an additive?

A. flame retardancy
B. buildup of static electricity
C. colour
D. toughness
Answer» B. buildup of static electricity
724.

Which of the following additive can act as curing agent for epoxides?

A. amines
B. sulphur
C. formaldehyde
D. all of the mentioned
Answer» B. sulphur
725.

Which of the following materials work as a polymeric flow promoters?

A. glyceryl stearates
B. calcium stearate
C. stearic acid
D. silicone fluids
Answer» B. calcium stearate
726.

Which of the following type of fillers are treated with chemicals to improve its attachment with polymers?

A. particulate fillers
B. rubbery fillers
C. mineral fillers
D. fibrous fillers
Answer» D. fibrous fillers
727.

When both the sources are effective it is called as __________

A. Double acting pump
B. Single acting pump
C. Triple acting pump
D. Normal pump
Answer» B. Single acting pump
728.

Reciprocating pump works like a positive displacement pump.

A. True
B. False
Answer» B. False
729.

In reciprocating pumps, the chamber in which the liquid is trapped is a stationary cylinder that contains piston or cylinder

A. True
B. False
Answer» B. False
730.

During the suction stroke the _______ moves left thus creating vacuum in the Cylinder.

A. Piston
B. Cylinder
C. Valve
D. Pump
Answer» B. Cylinder
731.

Reciprocating pump is a type of ___________

A. Positive displacement pump
B. Bicycle pump
C. Multistage pumps
D. Centrifugal pumps
Answer» B. Bicycle pump
732.

How many number of valves are required for the rotary pump?

A. 0
B. 1
C. 2
D. 3
Answer» B. 1
733.

Which of the following query will disable the index on Employee table?

A. ALTER INDEX IX_Employee_OrganizationLevel_OrganizationNode EmployeeDISABLE;
B. ALTER INDEX IX_Employee_OrganizationLevel_OrganizationNode ON HumanResourcesDISABLE;
C. CREATE INDEX IX_Employee_OrganizationLevel_OrganizationNode ON HumanResources.EmployeeDISABLE;
D. None of the mentioned
Answer» B. ALTER INDEX IX_Employee_OrganizationLevel_OrganizationNode ON HumanResourcesDISABLE;
734.

The SORT_IN_TEMPDB option cannot be set for ________ statements.

A. ALTER INDEX
B. DROP INDEX
C. CREATE INDEX
D. All of the mentioned
Answer» C. CREATE INDEX
735.

Which of the following index operation require additional disk space?

A. UPDATE INDEX
B. DROP INDEX MOVE TO
C. ALTER INDEX ADD CONSTRAINT
D. All of the mentioned
Answer» C. ALTER INDEX ADD CONSTRAINT
736.

Which of the following index operations require no additional disk space?

A. ALTER INDEX
B. DROP INDEX
C. CREATE INDEX
D. All of the mentioned
Answer» E.
737.

Which of the following query disables all the indexes on Employee table?

A. ALTER INDEX MUL ON HumanResources.EmployeeDISABLE;
B. ALTER INDEX NEST ON HumanResources.EmployeeDISABLE;
C. ALTER INDEX ALL ON HumanResources.EmployeeENABLE;
D. ALTER INDEX ALL ON HumanResources.EmployeeDISABLE;
Answer» E.
738.

Which of the following query can enable all indexes on Employee table?

A. DBCC DBREINDEX (“Employee”, ” “);
B. DBCC DBREINDEX (“EMP”, ” “);
C. DBCC DBREINDEX (“HumanResources.Employee”, “ALL”);
D. None of the mentioned
Answer» B. DBCC DBREINDEX (“EMP”, ” “);
739.

Which of the following query enables the IX_Employee_OrganizationLevel_OrganizationNode index on the Employee table?

A. DBCC DBREINDEX (“Employee”, IX_Employee_OrganizationLevel_OrganizationNode);
B. DBCC REINDEX (“Employee”, IX_Employee_OrganizationLevel_OrganizationNode);
C. DBCC DBINDEX (“Employee”, IX_Employee_OrganizationLevel_OrganizationNode);
D. All of the mentioned
E. ;b) DBCC REINDEX (“Employee”, IX_Employee_OrganizationLevel_OrganizationNode);c) DBCC DBINDEX (“Employee”, IX_Employee_OrganizationLevel_OrganizationNode);d) All of the mentioned
Answer» B. DBCC REINDEX (“Employee”, IX_Employee_OrganizationLevel_OrganizationNode);
740.

What is the strength of polymer adsorbent?

A. Cheapest hydrophobic adsorbent
B. Only practical adsorbent for adsorption of O2 and N2
C. Can be regenerated by burning more easily
D. Less prone to fouling
Answer» E.
741.

What is the strength of carbon molecular sieves?

A. Cheapest hydrophobic adsorbent
B. Only practical adsorbent for adsorption of O2 and N2
C. Can be regenerated by burning more easily
D. Less prone to fouling
Answer» C. Can be regenerated by burning more easily
742.

What is activated carbon?

A. Microcrystalline graphite form of carbon
B. Nanocrystalline graphite form of carbon
C. Mircocrystalline non-graphite form of carbon
D. Nanocrystalline non-graphite form of carbon
Answer» B. Nanocrystalline graphite form of carbon
743.

Which has high output drive?

A. Bipolar
B. CMOS
C. FET
D. pnp
Answer» B. CMOS
744.

Which device has very high speed?

A. CMOS
B. FET
C. GaAs
D. MESFET
Answer» D. MESFET
745.

Switching delays of GaAs is in the range of

A. 40-50
B. 20-30
C. 100-120
D. 70-80
Answer» E.
746.

Second generation gallium arsenide device are

A. high electron mobility transistor
B. heterojunction bipolar transistor
C. high electron mobility & heterojunction bipolar transistors
D. none of the mentioned
Answer» D. none of the mentioned
747.

______ has high packing density.

A. CMOS
B. bipolar
C. GaAs
D. CMOS and GaAs
Answer» E.
748.

Which has low power dissipation?

A. CMOS
B. bipolar
C. GaAs
D. NMOS
Answer» B. bipolar
749.

How many synaptic connection are there in human brain?

A. 1010
B. 1015
C. 1020
D. 105
Answer» C. 1020
750.

Why can’t we design a perfect neural network?

A. full operation is still not known of biological neurons
B. number of neuron is itself not precisely known
C. number of interconnection is very large & is very complex
D. all of the mentioned
Answer» E.