Explore topic-wise MCQs in Manufacturing Processes.

This section includes 10 Mcqs, each offering curated multiple-choice questions to sharpen your Manufacturing Processes knowledge and support exam preparation. Choose a topic below to get started.

1.

IN_THE_BEGINNING_OF_THE_ELECTROCHEMICAL_ETCHING,_SOME_OF_THESE_PITS_PRESENT_ON_THE_SURFACE_OF_THE_SILICON_WAFER_DEVELOP_INTO_MESOPORES.?$

A. True
B. False
Answer» B. False
Discussion
2.

THE_ELECTRIC_FIELD_STRENGTH_DECREASES_AROUND_THE_DEPRESSIONS_PRESENT_ON_THE_SILICON_WAFER_SURFACE.?$

A. True
B. False
Answer» C.
Discussion
3.

Avalanche breakdown is the dominant mechanism at high doping densities?

A. True
B. False
Answer» C.
Discussion
4.

When the doping density in the silicon wafer is increased, then _____

A. electric field strength is increased
B. width of depletion region is increased
C. hinderance to charge carries is increased
D. quality of the product is increased
Answer» B. width of depletion region is increased
Discussion
5.

Arrays of cone-like silicon dioxide pillars can be produced using _____

A. truncated MpSi
B. conical MpSi
C. cylindrical MpSi
D. planner MpSi
Answer» C. cylindrical MpSi
Discussion
6.

It possible to produce arrays of silicon dioxide pillars inside _____

A. long pipes
B. spherical cavities
C. truncated pyramids
D. thin shells
Answer» D. thin shells
Discussion
7.

Lithographic technique can be used for patterning the Si wafer.

A. True
B. False
Answer» B. False
Discussion
8.

Length of the silicon dioxide pillars is dependant on the etching time and the pore length.

A. True
B. False
Answer» B. False
Discussion
9.

Silicon oxide layer can be removed using HF solution.

A. True
B. False
Answer» B. False
Discussion
10.

Bending curvature of silicon wafers varies ______ with the specific area of the MpSi structure.

A. linearly
B. inversely
C. cubically
D. it not affected by specific area
Answer» B. inversely
Discussion