Explore topic-wise MCQs in Manufacturing Processes.

This section includes 5 Mcqs, each offering curated multiple-choice questions to sharpen your Manufacturing Processes knowledge and support exam preparation. Choose a topic below to get started.

1.

Plasma etching provides poor thickness control.

A. True
B. False
Answer» C.
Discussion
2.

In plasma etch, the chemical etchant is introduced in the gas phase.

A. True
B. False
Answer» B. False
Discussion
3.

In dry etching ______________ are used for removing material.

A. solvent etchants
B. gaseous etchants
C. carbide tools
D. powder etchants
Answer» C. carbide tools
Discussion
4.

Silicon dioxide etch rate at 90 C using 30 % KOH is approximately ______________

A. 1 m/hr
B. 5 m/hr
C. 10 m/hr
D. 100 m/hr
Answer» B. 5 m/hr
Discussion
5.

Etching process should be selective to the material that has to be removed.

A. True
B. False
Answer» B. False
Discussion