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Friction Welding in Manufacturing Processes
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The time for etching is independent of material to..
1.
The time for etching is independent of material to be removed.
A.
True
B.
False
Answer» C.
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Related MCQs
In case of over-etching, material under protective layer gets removed.
Product after etching of Si wafer with KOH is ______________ shape.
Incomplete etch occurs due to ___________
IN_CASE_OF_OVER-ETCHING,_MATERIAL_UNDER_PROTECTIVE_LAYER_GETS_REMOVED.?$
Product after etching of Si wafer with KOH is ______________ shape?
Incomplete etch occurs due to __________?
The wet etching process is ___________
Wet etching is used for removal of material from large areas.
The time for etching is independent of material to be removed.
________________ is used to protect the remaining area of the wafer while machining.
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