MCQOPTIONS
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MCQOPTIONS
This section includes 12 Mcqs, each offering curated multiple-choice questions to sharpen your Electronic Devices Circuits knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
Which of the following characteristics makes passive heat sinks differently from active heat sinks? |
| A. | It possess mechanical components |
| B. | It possess electrical components |
| C. | Does not possess mechanical components |
| D. | It possess electrical & mechanical components |
| Answer» D. It possess electrical & mechanical components | |
| 2. |
The epoxy bond between the heat sink and component is __________ |
| A. | Temporary |
| B. | Loosened |
| C. | Permanent/semi-permanent |
| D. | Highend |
| Answer» D. Highend | |
| 3. |
WHICH_OF_THE_FOLLOWING_CHARACTERISTICS_MAKES_PASSIVE_HEAT_SINKS_DIFFERENTLY_FROM_ACTIVE_HEAT_SINKS??$ |
| A. | It possess mechanical components |
| B. | It possess electrical components |
| C. | Does not possess mechanical components |
| D. | It possess electrical & mechanical components |
| Answer» D. It possess electrical & mechanical components | |
| 4. |
The epoxy bond between the heat sink and component is _________? |
| A. | Temporary |
| B. | Loosened |
| C. | Permanent/semi-permanent |
| D. | Highend |
| Answer» D. Highend | |
| 5. |
Which of the following is not an application of transistor heat sinks? |
| A. | Soldering |
| B. | Light Emitting Diode Lamps |
| C. | Microprocessor Cooling |
| D. | Environment Monitoring Systems |
| Answer» E. | |
| 6. |
_______are usually utilized to extract heat from a variety of heat generating bodies to a heat sink. |
| A. | square fins |
| B. | cylindrical fins |
| C. | cavities |
| D. | no option |
| Answer» D. no option | |
| 7. |
How can a pin fin heat sink be classified on the basis of fin arrangements? |
| A. | Pin, straight pin, flared pin |
| B. | Pin, circular pin, cylindrical pin |
| C. | Straight pin, circular pin, isotopic pin |
| D. | No classification |
| Answer» B. Pin, circular pin, cylindrical pin | |
| 8. |
How can one decrease the spreading resistance in the base of the heat sink? |
| A. | Increase the base thickness. |
| B. | Decrease the base thickness. |
| C. | Choosing a material with less conductivity. |
| D. | There is no possible way. |
| Answer» B. Decrease the base thickness. | |
| 9. |
Fin efficiency is increased by_______ |
| A. | Using insulating material |
| B. | Decreasing the fin aspect ratio |
| C. | Using more conductive material |
| D. | Decreasing the fin aspect ratio & Using more conductive material |
| Answer» E. | |
| 10. |
Copper has around twice the thermal conductivity of aluminum. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 11. |
Heat sinks work through the process of _______ |
| A. | resistive heat transfer |
| B. | conductive and convection heat transfer |
| C. | active process |
| D. | no heat transfer |
| Answer» C. active process | |
| 12. |
Why does the heat sink has fins? |
| A. | to provide cooling to the processor |
| B. | to provide airflow to the radiator |
| C. | to preserve the energy |
| D. | to provide radiator to the airflow |
| Answer» B. to provide airflow to the radiator | |