MCQOPTIONS
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MCQOPTIONS
This section includes 12 Mcqs, each offering curated multiple-choice questions to sharpen your Microwave Engineering knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
MMICs have higher circuit flexibility as compared to other microwave integrated fabrication methods. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 2. |
MMICs are the best microwave integrated circuit fabrication methodologies without any drawbacks in it. |
| A. | True |
| B. | False |
| Answer» C. | |
| 3. |
MMICS_ARE_THE_BEST_MICROWAVE_INTEGRATED_CIRCUIT_FABRICATION_METHODOLOGIES_WITHOUT_ANY_DRAWBACKS_IN_IT.?$ |
| A. | True |
| B. | False |
| Answer» C. | |
| 4. |
MMICs_have_higher_circuit_flexibility_as_compared_to_other_microwave_integrated_fabrication_methods.$ |
| A. | True |
| B. | False |
| Answer» B. False | |
| 5. |
Processing in MMICs is done by _________? |
| A. | Ion implantation |
| B. | Net list generation |
| C. | Floor planning |
| D. | None of the mentioned |
| Answer» B. Net list generation | |
| 6. |
Resistors used at normal operating frequencies can be directly used at microwave frequencies in MMIc. |
| A. | True |
| B. | False |
| Answer» C. | |
| 7. |
For the capacitors used in MMICs, the insulating dielectric films used are: |
| A. | Air |
| B. | SiO |
| C. | Titanium |
| D. | GaAs |
| Answer» C. Titanium | |
| 8. |
Transmission lines and other conductors in microwave devices are usually made with ___________ |
| A. | Gold metallization |
| B. | Silver metallization |
| C. | Copper metallization |
| D. | Zinc metallization |
| Answer» B. Silver metallization | |
| 9. |
GaAs MESFETs are versatile device because it finds application in: |
| A. | Low-noise amplifiers |
| B. | High gain amplifiers |
| C. | Mixers |
| D. | All of the mentioned |
| Answer» E. | |
| 10. |
The substrate of an MMIC must be a _____________ to accommodate the fabrication of all the type of devices. |
| A. | Semiconductor |
| B. | Insulator |
| C. | Partial conductors |
| D. | Metals operable at high frequencies |
| Answer» B. Insulator | |
| 11. |
MMICs are high cost devices that involve complex fabrication methods and contain multiple layers to contain even small circuits. |
| A. | True |
| B. | False |
| Answer» C. | |
| 12. |
Progress in ________ and other related semiconductors material processing led to the feasibility of monolithic microwave integrated circuits. |
| A. | GaAs |
| B. | Silicon |
| C. | Germanium |
| D. | GaAlAs |
| Answer» B. Silicon | |