Explore topic-wise MCQs in Electrical Engineering.

This section includes 1232 Mcqs, each offering curated multiple-choice questions to sharpen your Electrical Engineering knowledge and support exam preparation. Choose a topic below to get started.

1051.

FCC metals have value of critical shear stress as compared to BCC metals

A. same
B. lower
C. higher
D. random
Answer» C. higher
1052.

slip starts to occur when the value of resolved shear stress

A. reduces below critical shear stress
B. is at critical shear stress
C. increases abive critical shear stress
D. none of the above
Answer» D. none of the above
1053.

the law is used to determine the value of critical shear stress

A. millers
B. burgers
C. schmids
D. none of the above
Answer» D. none of the above
1054.

the maximum resolved shear stress is given by

A. Ƭresolve = σt
B. Ƭresolve = σt/3
C. Ƭresolve = σt/2
D. none of the above
Answer» D. none of the above
1055.

the schmids law is used to calculate critical shear stress for _                     structure

A. polycrystalli ne
B. single crystal
C. atoms
D. none of the above
Answer» C. atoms
1056.

number of slip systems in FCC are

A. 12
B. 24
C. 21
D. 26
Answer» B. 24
1057.

number of slip systems in metals decides about

A. hardness of metals
B. strength of metal
C. ductility of metal
D. all of the above
Answer» D. all of the above
1058.

metals with FCC and BCC crystal structure are often subjected to

A. slip
B. twinning
C. combination of slip and twinning
D. all of the above
Answer» E.
1059.

metals with FCC crystal structure are often subjected to

A. slip
B. twinning
C. less of slip and more of twinning
D. all of the above
Answer» E.
1060.

the mechanism can be takes place due to thermal treatment

A. slip
B. twinning
C. combination of slip and twinning
D. all of the above
Answer» C. combination of slip and twinning
1061.

the can be seen in metal even after polishing

A. slip
B. twinning
C. combination of slip and twinning
D. all of the above
Answer» C. combination of slip and twinning
1062.

The appears as a single thin line in the microscopic structure

A. slip
B. twinning
C. combination of slip and twinning
D. all of the above
Answer» B. twinning
1063.

the appears as a pair of thick lines in the microscopic structure even after polishing

A. slip
B. twinning
C. combination of slip and twinning
D. all of the above
Answer» C. combination of slip and twinning
1064.

               requires more stress to be initiated with respect to

A. slip, twinning
B. twinning, slip
C. grain boundary defect, slip
D. none of the above
Answer» C. grain boundary defect, slip
1065.

as compared to slip the stress required to propogate twin is

A. more
B. lesser
C. constant
D. varies randomly
Answer» C. constant
1066.

the disappears after polishing

A. slip
B. twinning
C. combination of slip and twinning
D. all of the above
Answer» B. twinning
1067.

twinning occurs along plane and direction

A. random, specific
B. specific, random
C. random, random
D. specific, specific
Answer» E.
1068.

generally metals with crystal structure shows plastic deformation mainly by twinning mechanism

A. bcc
B. fcc
C. hcp
D. a and c
Answer» D. a and c
1069.

generally metals with crystal structure shows plastic deformation mainly by slip mechanism

A. bcc
B. fcc
C. hcp
D. a and c
Answer» E.
1070.

generally metals with crystal structure are more ductile

A. bcc
B. fcc
C. hcp
D. a and c
Answer» C. hcp
1071.

twining is the phenomenon observed due to

A. mechanical treatment
B. thermal treatment
C. chemical treatment
D. a or b
Answer» E.
1072.

the plastic deformation takes place due to and

A. slip
B. twin
C. both of the above
D. none of the above
Answer» D. none of the above
1073.

metals are more ductile than metals

A. bcc,fcc
B. fcc,bcc
C. hcp,bcc
D. bcc,hcp
Answer» C. hcp,bcc
1074.

the planes along which mirror image is formed is called planes

A. defective
B. imperfect
C. slip
D. twin
Answer» E.
1075.

in twinning, the structure in the distorted region forms of the crystal structure in the distorted region

A. random orientation
B. mirror image
C. a or b
D. none of the above
Answer» C. a or b
1076.

twin takes place due to

A. stress applied on material
B. chemical reaction within material
C. atmospheric reaction
D. none of the above
Answer» B. chemical reaction within material
1077.

slip direction is direction in the slip plane which has

A. least number of atoms
B. random number of atoms
C. maximum number of atoms
D. no atoms
Answer» D. no atoms
1078.

slip occurs on plae which has

A. least number of atoms
B. random number of atoms
C. maximum number of atoms
D. no atoms
Answer» D. no atoms
1079.

in slip, the crystal structure above and below the plane remains

A. distorted
B. undistorted
C. sometimes distorted
D. none of the above
Answer» C. sometimes distorted
1080.

slip occurs along             plane and in direction

A. random, specific
B. specific, random
C. random, random
D. specific, specific
Answer» E.
1081.

slip takes place due to

A. stress applied on material
B. chemical reaction within material
C. atmospheric reaction
D. none of the above
Answer» B. chemical reaction within material
1082.

the plane on which slip takes place is called plane

A. defective
B. imperfect
C. slip
D. twin
Answer» D. twin
1083.

slip is defined as displacement of one part of crystal relative to other

A. tensile
B. compressive
C. shear
D. bending
Answer» D. bending
1084.

the plastic deformation can takes place through

A. slip
B. twinning
C. combination of slip and twinning
D. all of the above
Answer» E.
1085.

  mechannnial properties of the metal after plastic deformation

A. increases
B. either increase or decrease
C. remains constant
D. none of the above
Answer» C. remains constant
1086.

different shapes can be permentaly given to metals by virtue of property

A. elastic
B. plastic
C. none of the above
D. both a and b
Answer» C. none of the above
1087.

stress required during plastic deformation is than that required during elastic deformation

A. equal
B. high
C. low
D. b or c
Answer» C. low
1088.

when the metal is stresses above its elastic limit, the resulting deformation is

A. permenant
B. temporary
C. partially permenant
D. a or c
Answer» E.
1089.

when the metal is stresses below its elastic limit, the resulting deformation is

A. permenant
B. temporary
C. partially permenant
D. none of the above
Answer» C. partially permenant
1090.

in screw dislocation

A. the region in dislocation is under tension and below is under compression
B. the region in dislocation is under compression and below is under tension
C. the region in dislocation is under shear
D. none of the above
Answer» D. none of the above
1091.

the dislocations are classified as

A. edge dislocation
B. screw dislocation
C. positive and negative edge dislocation
D. all of the above
Answer» E.
1092.

in positive edge dislocation

A. extra row of atoms is present in the upper region
B. extra row of atoms is present in lower region
C. any one of above
D. none of the above
Answer» B. extra row of atoms is present in lower region
1093.

dislocations are known as

A. one dimensional defect
B. zero dimensional defect
C. two dimenstiona l defect
D. none of the above
Answer» B. zero dimensional defect
1094.

vacancies are known as _

A. one dimensional defect
B. zero dimensional defect
C. two dimenstiona l defect
D. none of the above
Answer» C. two dimenstiona l defect
1095.

surface defects increase and decrease

A. hardness & strength
B. hardness and electrical conductivity
C. hardness and corrosion resistance
D. none of the above
Answer» B. hardness and electrical conductivity
1096.

the low angle boundary defect is assocaited with

A. high mismatch of crystalline orientation from one grain to adjacent grain
B. slight mismatch of crystalline orientation from one grain to adjacent grain
C. stacking mismatch of atomic planes
D. stacking faults
Answer» E.
1097.

the defect associated with slight mismatch of crystalline orientation from one grain to adjacent grain is called

A. gtrain boundaries defect
B. twinn boundaries defect
C. low angle boundary defect
D. stacking faults
Answer» D. stacking faults
1098.

the stacking fault defect is assocaited with

A. erroe in sequence of close- packed atomic planes
B. slight mismatch of crystalline orientation from one grain to adjacent grain
C. error in stacking of electrons in atomic structure
D. none of the above
Answer» B. slight mismatch of crystalline orientation from one grain to adjacent grain
1099.

the twin is the region

A. before and after the dialocation
B. between the atomic arrangmnets that has formed mirror image
C. low angle boundary defect
D. twin boundary defect
Answer» E.
1100.

the defect which has mirror image of atomic arrangement across the dislocation is called

A. grain boundary defect
B. stacking faults
C. low angle boundary defect
D. twin boundary defect
Answer» E.