Explore topic-wise MCQs in Manufacturing Processes.

This section includes 10 Mcqs, each offering curated multiple-choice questions to sharpen your Manufacturing Processes knowledge and support exam preparation. Choose a topic below to get started.

1.

IN_CHEMICAL_VAPOUR_DEPOSITION,_CHEMICALS_CONTAINING_THE_DESIRED_FILM/LAYER_ARE_USED.?$

A. True
B. False
Answer» B. False
2.

Low_pressure_chemical_vapour_deposition_(LPCVD)_is_used_to_____$

A. increase the purity of the film
B. to reduce the roughness of the film
C. to form thick films
D. to reduce stress on the film
Answer» E.
3.

For which of the following physical deposition technique is not suitable?

A. Deep trenches
B. Flat surfaces
C. Wafer of very reactive material
D. Rough surfaces
Answer» B. Flat surfaces
4.

In case of deep holes/grooves the choice of technique plays an important role.

A. True
B. False
Answer» B. False
5.

Which of the following has no role in selecting the type of growth technique?

A. Thickness of the film
B. Stress on the film
C. Temperature of the film
D. Purity of the film
Answer» D. Purity of the film
6.

How many deposition techniques are there?

A. 2
B. 3
C. 4
D. 5
Answer» B. 3
7.

In deposition, the Si from the wafer is consumed.

A. True
B. False
Answer» C.
8.

Which of the following does not hold true?

A. In epitaxial layers, poly Si is grown using deposition
B. For making trench capacitors deposited films are used
C. Deposited layers can also be used as passivation layers
D. Deposition is same as etching
Answer» E.
9.

In deposition process, material is added unlike etching where material is removed.

A. True
B. False
Answer» B. False
10.

In reactive ion etching, argon gas is ionized by bombarding with electrons.

A. True
B. False
Answer» B. False