MCQOPTIONS
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MCQOPTIONS
This section includes 10 Mcqs, each offering curated multiple-choice questions to sharpen your Manufacturing Processes knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
Low pressure chemical vapour deposition (LPCVD) is used to_____ |
| A. | increase the purity of the film |
| B. | to reduce the roughness of the film |
| C. | to form thick films |
| D. | to reduce stress on the film |
| Answer» E. | |
| 2. |
In chemical vapour deposition, chemicals containing the desired film/layer are used. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 3. |
For which of the following physical deposition technique is not suitable? |
| A. | Deep trenches |
| B. | Flat surfaces |
| C. | Wafer of very reactive material |
| D. | Rough surfaces |
| Answer» B. Flat surfaces | |
| 4. |
In case of deep holes/grooves the choice of technique plays an important role. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 5. |
Which of the following has no role in selecting the type of growth technique? |
| A. | Thickness of the film |
| B. | Stress on the film |
| C. | Temperature of the film |
| D. | Purity of the film |
| Answer» D. Purity of the film | |
| 6. |
How many deposition techniques are there? |
| A. | 2 |
| B. | 3 |
| C. | 4 |
| D. | 5 |
| Answer» B. 3 | |
| 7. |
In deposition, the Si from the wafer is consumed. |
| A. | True |
| B. | False |
| Answer» C. | |
| 8. |
Which of the following does not hold true? |
| A. | In epitaxial layers, poly Si is grown using deposition |
| B. | For making trench capacitors deposited films are used |
| C. | Deposited layers can also be used as passivation layers |
| D. | Deposition is same as etching |
| Answer» E. | |
| 9. |
In deposition process, material is added unlike etching where material is removed. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 10. |
In reactive ion etching, argon gas is ionized by bombarding with electrons. |
| A. | True |
| B. | False |
| Answer» B. False | |