Explore topic-wise MCQs in Manufacturing Processes.

This section includes 3 Mcqs, each offering curated multiple-choice questions to sharpen your Manufacturing Processes knowledge and support exam preparation. Choose a topic below to get started.

1.

In case of over-etching, material under protective layer gets removed.

A. True
B. False
Answer» B. False
Discussion
2.

Product after etching of Si wafer with KOH is ______________ shape.

A. square
B. circular at the end
C. trapezoidal
D. oval
Answer» D. oval
Discussion
3.

Incomplete etch occurs due to ___________

A. high concentration of the chemicals
B. high pressure
C. insufficient temperature
D. low chemical activity
Answer» D. low chemical activity
Discussion