MCQOPTIONS
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This section includes 3 Mcqs, each offering curated multiple-choice questions to sharpen your Manufacturing Processes knowledge and support exam preparation. Choose a topic below to get started.
| 1. |
In case of over-etching, material under protective layer gets removed. |
| A. | True |
| B. | False |
| Answer» B. False | |
| 2. |
Product after etching of Si wafer with KOH is ______________ shape. |
| A. | square |
| B. | circular at the end |
| C. | trapezoidal |
| D. | oval |
| Answer» D. oval | |
| 3. |
Incomplete etch occurs due to ___________ |
| A. | high concentration of the chemicals |
| B. | high pressure |
| C. | insufficient temperature |
| D. | low chemical activity |
| Answer» D. low chemical activity | |