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This section includes 17 Mcqs, each offering curated multiple-choice questions to sharpen your Mechanical Metallurgy knowledge and support exam preparation. Choose a topic below to get started.
1. |
If the Larsen-Miller parameter is 50*103 at the temperature of 600 degrees. The C1 is equal to 50. Find the fatigue life of the component in hr? |
A. | 1400 hr |
B. | 500 hr |
C. | 1442 hr |
D. | 54841 hr |
Answer» D. 54841 hr | |
2. |
The Laser miller parameter is defined as ____________ |
A. | T(ln t+C<sub>1</sub>) = P<sub>1</sub> |
B. | ln T(ln t+C<sub>1</sub>) = P<sub>1</sub> |
C. | T(t+C<sub>1</sub>) = P<sub>1</sub> |
D. | T/t+C<sub>1</sub> = P<sub>1</sub> |
Answer» B. ln T(ln t+C<sub>1</sub>) = P<sub>1</sub> | |
3. |
The Larser-Miller parameter is used to predict the creep strength and the life of the component in long time by comparing the results obtained at elevated temperature in shorter time. |
A. | True |
B. | False |
Answer» B. False | |
4. |
For a creep strain of 1% in 1000hr, determine the strain rate in sec-1 for the given material? |
A. | 10<sup>-2</sup> s<sup>-1</sup> |
B. | 10<sup>-5</sup> s<sup>-1</sup> |
C. | 2.8*10<sup>-9</sup> s<sup>-1</sup> |
D. | 10<sup>-9</sup> s<sup>-1</sup> |
Answer» D. 10<sup>-9</sup> s<sup>-1</sup> | |
5. |
According to Monkman and Grant, the relationship between the minimum creep rate and the rupture time is given as ________ (where the C and K are constant, and the tr is time to rupture and minimum creep rate). |
A. | t<sub>r</sub> + C = K |
B. | t<sub>r</sub> + C log = K |
C. | log t<sub>r</sub> + C log = K |
D. | t<sub>r</sub> + C = log K |
Answer» D. t<sub>r</sub> + C = log K | |
6. |
The high-temperature alloys are fabricated by which of the following method? |
A. | Rolling |
B. | Forging |
C. | Precision casting |
D. | Extrusion |
Answer» D. Extrusion | |
7. |
Which of the following is not a nickel-based high-temperature application alloy? |
A. | Astroloy |
B. | Inconel |
C. | Udimet |
D. | Vitallium |
Answer» E. | |
8. |
The Inconel is an alloy which consists of _____________ |
A. | Cr, Co, Mo |
B. | Cr, W, Ti |
C. | Cr, Ni, Fe |
D. | Ti, Al, Co |
Answer» D. Ti, Al, Co | |
9. |
Which of the following is not a high-temperature application precipitate? |
A. | VC |
B. | TiC |
C. | Cr<sub>23</sub>C<sub>6</sub> |
D. | Cu<sub>3</sub>Al |
Answer» E. | |
10. |
The Suzuki Interaction in the crystal lattice is defined as the interaction between _______ |
A. | dislocations |
B. | solute atom and dislocation |
C. | stacking faults |
D. | grain boundary and solute atom |
Answer» D. grain boundary and solute atom | |
11. |
Which of the following is preferred as solute for high-temperature application for metals? |
A. | Interstitial solute with low valance |
B. | Interstitial solute with high valance |
C. | Substitutional solute with high valance |
D. | Substitutional solute with low valance |
Answer» D. Substitutional solute with low valance | |
12. |
Which of the following strengthening mechanism is most effective in increasing the creep resistance of the material? |
A. | Precipitation hardening |
B. | Strain hardening |
C. | Dispersion strengthening |
D. | Solid solution strengthening |
Answer» D. Solid solution strengthening | |
13. |
The metal with ________ stacking fault energy has higher creep resistance. |
A. | low |
B. | high |
C. | average |
D. | alternate |
Answer» B. high | |
14. |
The larger grain material will have _________ equicohesive temperature(ECT), while the fine grain material will have ____________ ECT. |
A. | lower, higher |
B. | higher, lower |
C. | lower, lower |
D. | higher, higher |
Answer» C. lower, lower | |
15. |
The equicohesive temperature is a material property and always fixed for a given material. |
A. | True |
B. | False |
Answer» C. | |
16. |
The equicohesive temperature is defined as the temperature at which both the grain and grain boundary have the same strength. |
A. | True |
B. | False |
Answer» B. False | |
17. |
As the temperature increases in polycrystalline metal, the nature of fracture change from _____________ to __________ |
A. | intergranular, transgranular |
B. | transgranular, intergranular |
C. | tuctile, brittle |
D. | creep, fatigue |
Answer» C. tuctile, brittle | |