Explore topic-wise MCQs in Electronic Devices and Circuits.

This section includes 2 Mcqs, each offering curated multiple-choice questions to sharpen your Electronic Devices and Circuits knowledge and support exam preparation. Choose a topic below to get started.

1.

Which of the following characteristics makes passive heat sinks differently from active heat sinks?

A. It possess mechanical components
B. It possess electrical components
C. Does not possess mechanical components
D. It possess electrical & mechanical components
Answer» D. It possess electrical & mechanical components
Discussion
2.

The epoxy bond between the heat sink and component is __________

A. Temporary
B. Loosened
C. Permanent/semi-permanent
D. Highend
Answer» D. Highend
Discussion