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This section includes 28 Mcqs, each offering curated multiple-choice questions to sharpen your Electronics knowledge and support exam preparation. Choose a topic below to get started.
1. |
Totem pole outputs _________ be connected __________ because ____________. |
A. | can, in parallel, sometimes higher current is required |
B. | cannot, together, if the outputs are in opposite states excessively high currents can damage one or both devices |
C. | should, in series, certain applications may require higher output voltage |
D. | can, together, together they can handle larger load currents and higher output voltages |
Answer» C. should, in series, certain applications may require higher output voltage | |
2. |
Integrated-injection logic offers high component density and is easier to fabricate than TTL. |
A. | 1 |
B. | |
Answer» B. | |
3. |
Schottky TTL logic gates overcome the problem of saturation delay time. |
A. | 1 |
B. | |
Answer» B. | |
4. |
The output current capability of a single 7400 NAND gate when HIGH is called _____________. |
A. | source current |
B. | sink current |
C. | IOH |
D. | source current or IOH |
Answer» B. sink current | |
5. |
A three-state output TTL can have three possible outputs: LOW, HIGH, or FLOATING. |
A. | 1 |
B. | |
Answer» C. | |
6. |
One example of the use of a Schmitt trigger is as a(n) _____ |
A. | astable oscillator |
B. | transition pulse generator |
C. | pulse shaper |
D. | buffer |
Answer» D. buffer | |
7. |
An open collector output can ________ current, but it cannot ___________________. |
A. | sink, source current |
B. | source, sink current |
C. | sink, source voltage |
D. | source, sink voltage |
Answer» B. source, sink current | |
8. |
When the output of a standard TTL gate is HIGH, it can ___________________. |
A. | sink 16 mA of current from the attached input gates |
B. | source 400 A of current to no more than 10 attached gates |
C. | source 16 mA of current to no more than 10 attached gates |
D. | sink a maximum of 400 A from no more than 10 load gates |
Answer» C. source 16 mA of current to no more than 10 attached gates | |
9. |
5400 TTL series logic chips are made to military specifications. |
A. | 1 |
B. | |
Answer» B. | |
10. |
An undefined state, neither high nor low, is called _________. |
A. | don't care |
B. | floating |
C. | minimum state |
D. | noise |
Answer» C. minimum state | |
11. |
The number of inputs that a gate output can drive without possible logic errors is the _______. |
A. | propagation delay |
B. | noise margin |
C. | speed-power product |
D. | fanout |
Answer» E. | |
12. |
CMOS logic is probably the best all-around circuitry because of its: |
A. | packing density |
B. | low power consumption |
C. | very high noise immunity |
D. | low power consumption and very high noise immunity |
Answer» E. | |
13. |
A TTL totem pole circuit is designed so that the output transistors are: |
A. | always on together |
B. | providing phase splitting |
C. | providing voltage regulation |
D. | never on together |
Answer» E. | |
14. |
In order to get a HIGH or a LOW output from an open-collector gate, an external _________ must be connected between +VCC and the collector. |
A. | pull-down resistor |
B. | pull-up resistor |
C. | diode |
D. | buffer |
Answer» C. diode | |
15. |
CMOS circuits consume less power than TTL circuits. |
A. | 1 |
B. | |
C. | 1 |
D. | |
Answer» B. | |
16. |
Totem pole output circuits can change states faster than open-collector output circuits. |
A. | 1 |
B. | |
Answer» B. | |
17. |
What quantities must be compatible when interfacing two different logic families? |
A. | only the currents |
B. | both the voltages and the currents |
C. | only the voltages |
D. | both the power dissipation and the impedance |
Answer» C. only the voltages | |
18. |
NMOS devices use MOSFETs to implement the full range of logic gates using the universal NAND gate. |
A. | 1 |
B. | |
C. | 1 |
D. | |
Answer» C. 1 | |
19. |
Large-scale integration (LSI) ICs contain between ______ and _______ interconnected components. |
A. | 15,000, 150,000 |
B. | 1,500, 15,000 |
C. | 180, 1,000 |
D. | 180, 1,500 |
Answer» C. 180, 1,000 | |
20. |
Delay times and current/voltage values remain constant regardless of temperature or other operating conditions for robust circuits like TTL. |
A. | 1 |
B. | |
Answer» C. | |
21. |
The time needed for an output to change as the result of an input change is known as: |
A. | noise immunity |
B. | fanout |
C. | propagation delay |
D. | rise time |
Answer» D. rise time | |
22. |
Low power consumption achieved by CMOS circuits is due to which construction characteristic? |
A. | complementary pairs |
B. | connecting pads |
C. | DIP packages |
D. | small-scale integration |
Answer» B. connecting pads | |
23. |
PMOS and NMOS ____________________________. |
A. | represent MOSFET devices utilizing either P-channel or N-channel devices exclusively within a given gate |
B. | are enhancement type CMOS devices used to produce a series of high-speed logic known as 74HC |
C. | represent positive and negative MOS type devices that can be operated from differential power supplies and are compatible with operational amplifiers |
D. | none of the above |
Answer» B. are enhancement type CMOS devices used to produce a series of high-speed logic known as 74HC | |
24. |
The problem of interfacing IC logic families that have different supply voltages (VCCs) can be solved by using a: |
A. | level-shifter |
B. | tri-state shifter |
C. | translator |
D. | level-shifter or translator |
Answer» E. | |
25. |
Which digital IC package type makes the most efficient use of printed circuit board space? |
A. | SMT |
B. | TO can |
C. | flat pack |
D. | DIP |
Answer» B. TO can | |
26. |
When an IC has two rows of parallel connecting pins, the device is referred to as: |
A. | a QFP |
B. | a DIP |
C. | a phase splitter |
D. | CMOS |
Answer» C. a phase splitter | |
27. |
The range of a valid LOW input is: |
A. | 0.0 V to 0.4 V |
B. | 0.4 V to 0.8 V |
C. | 0.4 V to 1.8 V |
D. | 0.4 V to 2.4 V |
Answer» C. 0.4 V to 1.8 V | |
28. |
A digital logic device used as a buffer should have what input/output characteristics? |
A. | high input impedance and high output impedance |
B. | low input impedance and high output impedance |
C. | low input impedance and low output impedance |
D. | high input impedance and low output impedance |
Answer» E. | |