Explore topic-wise MCQs in ENGINEERING SERVICES EXAMINATION (ESE).

This section includes 451 Mcqs, each offering curated multiple-choice questions to sharpen your ENGINEERING SERVICES EXAMINATION (ESE) knowledge and support exam preparation. Choose a topic below to get started.

401.

The power factor at the input terminals of a cyclo- converter is generally

A. low and leading
B. low and lagging
C. high and leading
D. high and lagging
Answer» C. high and leading
402.

Ripple factor RF and form factor FF are related as

A. RF = FF² - 1
B. RF = (FF² - 1)^0.5
C. RF = √FF - 1
D. RF = (FF - 1)^0.5
Answer» C. RF = √FF - 1
403.

Modified Mc Murray full bridge inverter uses

A. 4 thyristors and 2 diodes
B. 4 thyristors and 4 diodes
C. 8 thyristors and 4 diodes
D. 8 thyristors and 8 diodes
Answer» E.
404.

In the below figure the average load current is 15 A. The rms value of transformer secondary current is

A. 15 A
B. 10.61 A
C. 7.5 A
D. 14.14 A
Answer» C. 7.5 A
405.

A dc chopper is feeding an RLE load. The maximum steady state ripple is

A. A
B. B
C. C
D. D
Answer» B. B
406.

Figure shows a chopper feeding RLE load, The free wheeling diode conducts when

A. thyristor is on
B. thyristor is off
C. both when thyristor is on and thyristor is off
D. partly when thyristor is off and partly when thyristor is on
Answer» C. both when thyristor is on and thyristor is off
407.

A single phase half wave rectifier is feeding a resistive load. Input voltage v = Vm sin ωt. The output dc voltage is Vdc and output rms voltage is Vrms . If firing angle is 180°, Vdc and Vrms respectively are

A. A
B. B
C. C
D. D
Answer» B. B
408.

In a single phase full wave converter (M-2 connection) feeding on R - L load, the input voltage is v = Vm sin ωt. The expression for dc output voltage is

A. A
B. B
C. C
D. D
Answer» D. D
409.

The output characteristics of a MOSFET, is a plot of

A. Id as a function of Vgs with Vds as a parameter
B. Id as a function of Vds with Vgs as a parameter
C. Ig as a function of Vgs with Vds as a parameter
D. Ig as a function of Vds with Vgs as a parameter
Answer» C. Ig as a function of Vgs with Vds as a parameter
410.

In the transfer characteristics of a MOSFET, the threshold voltage is the measure of the

A. minimum voltage to induce a n-channel/p-channel for conduction
B. minimum voltage till which temperature is constant
C. minimum voltage to turn off the device
D. none of the above mentioned is true
Answer» B. minimum voltage till which temperature is constant
411.

 The controlling parameter in MOSFET is

A. Vds
B. Ig
C. Vgs
D. Is
Answer» C. Vgs
412.

The arrow on the symbol of MOSFET indicates

A. that it is a N-channel MOSFET
B. the direction of electrons
C. the direction of conventional current flow
D. that it is a P-channel MOSFET
Answer» C. the direction of conventional current flow
413.

Choose the correct statement

A. MOSFET is a uncontrolled device
B. MOSFET is a voltage controlled device
C. MOSFET is a current controlled device
D. MOSFET is a temperature controlled device
Answer» C. MOSFET is a current controlled device
414.

Which of the following terminals does not belong to the MOSFET?

A. Drain
B. Gate
C. Base
D. Source
Answer» D. Source
415.

The MOSFET combines the areas of _______ & _________

A. field effect & MOS technology
B. semiconductor & TTL
C. mos technology & CMOS technology
D. none of the mentioned
Answer» B. semiconductor & TTL
416.

A power BJT is used as a power control switch by biasing it in the cut off region (off state) or in the saturation region (on state). In the on state

A. both the base-emitter & base-collector junctions are forward biased
B. the base-emitter junction is reverse biased, and the base collector junction is forward biased
C. the base-emitter junction is forward biased, and the base collector junction is reversed biased
D. both the base-collector & the base-emitter junctions are reversed biased
Answer» B. the base-emitter junction is reverse biased, and the base collector junction is forward biased
417.

A power transistor is a _________ device.

A. two terminal, bipolar, voltage controlled
B. two terminal, unipolar, current controlled
C. three terminal, unipolar, voltage controlled
D. three terminal, bipolar, current controlled
Answer» E.
418.

A power transistor is a

A. three layer, three junction device
B. three layer, two junction device
C. two layer, one junction device
D. four layer, three junction device
Answer» C. two layer, one junction device
419.

Which of the following devices does not belong to the transistor family?

A. IGBT
B. MOSFET
C. GTO
D. BJT
Answer» D. BJT
420.

Zener diodes allow a current to flow in the reverse direction, when the

A. voltage reaches above a certain value
B. temperature reaches above a certain value
C. current always flows in the reverse direction only
D. current cannot flow in the reverse direction
Answer» B. temperature reaches above a certain value
421.

In a certain power electronics application, it is required that the voltage at the load terminals is to be kept within a certain range of voltages only. Among the device listed below, which would be the most ideal choice for this application? 

A. P-n junction diode
B. Schottky diode
C. Zener diode
D. Fast recover diode
Answer» D. Fast recover diode
422.

As compared to a p-n junction device of equal rating, the Schottky diode has

A. lower reverse voltage rating
B. lower reverse leakage current
C. higher Switching time
D. higher cut-in voltage
Answer» B. lower reverse leakage current
423.

 In a Schottky diode, the aluminum metal acts as a __________

A. anode
B. cathode
C. cathode
D. common terminal
Answer» B. cathode
424.

Schottky diodes are also called as

A. metal diode
B. hot carrier diode
C. signaling diode
D. easy turn on diode
Answer» C. signaling diode
425.

When reverse breakdown occurs in a diode

A. voltage increases & current is constant
B. voltage increases & current also increases
C. both are constant
D. voltage is constant & current increases
Answer» E.
426.

Ideally the voltage drop across a conducting diode must be

A.
B. 0
C. higher than the forward biased voltage
D. equal to the forward biased voltage
Answer» C. higher than the forward biased voltage
427.

A Schottky diode can be switchd off much faster than an equivalent p-n junction diode due to its

A. higher operating frequency
B. no recombination of charges
C. more compact structure
D. None of the mentioned
Answer» C. more compact structure
428.

A Schottky diode has __________

A. a gate terminal
B. aluminum-silicon junction
C. platinum gold junction
D. germanium-Arsenide junction
Answer» C. platinum gold junction
429.

As compared to a p-n junction diode(of the same rating), a Schottky diode has ___________

A. higher cut-in voltage
B. lower reverse leakage current
C. higher operating frequency
D. higher switching time
Answer» D. higher switching time
430.

 In a Schottky diode, the silcon is usually

A. N-type
B. P-type
C. un-doped semiconductor
D. silicon is not used
Answer» B. P-type
431.

Which of the following are/is the majority charge carriers in a Schottky diode?

A. Holes
B. Electrons
C. Both holes & Electrons carry equal current
D. None of the mentioned
Answer» C. Both holes & Electrons carry equal current
432.

Which of the below mentioned statements is false regarding Schottky diodes?

A. Schottky diodes have a Al-Silicon junction
B. There is no storage of charges in a Schottky diode
C. The majority charge carriers in a Schottky diode are holes
D. Schottky diodes can be switched off faster than a p-n junction diode of the same rating
Answer» D. Schottky diodes can be switched off faster than a p-n junction diode of the same rating
433.

Which of the following diodes uses a metal-semiconductor junction?

A. General purpose diodes
B. Fast recovery diodes
C. Schottky diode
D. None of the mentioned
Answer» D. None of the mentioned
434.

In order to reduce the reverse recovery time of the diodes, __________ is carried out.

A. shortening of the length of the device
B. platinum & gold doping
C. antimony doping
D. adding an extra silicon layer
Answer» C. antimony doping
435.

A power diode with small softness factor (S-factor) has

A. small oscillatory over voltages
B. large oscillatory over voltages
C. large peak reverse current
D. small peak reverse current
Answer» C. large peak reverse current
436.

A diode is said to be forward biased when the

A. cathode is positive with respect to the anode
B. anode is positive with respect to the cathode
C. anode is negative with respect to the anode
D. both cathode & anode are positive
Answer» C. anode is negative with respect to the anode
437.

A diode is said to be reversed biased when the

A. cathode is positive with respect to the anode
B. anode is positive with respect to the cathode
C. cathode is negative with respect to the anode
D. both cathode & anode are negative
Answer» B. anode is positive with respect to the cathode
438.

Which of the following is true in case of a power diode with R load?

A. I grows almost linearly with V
B. I decays almost linearly with V
C. I is independent of V
D. I initial grows than decays
Answer» B. I decays almost linearly with V
439.

The V-I Characteristics of the diode lie in the

A. 1st & 2nd quadrant
B. 1st & 3rd quadrant
C. 1st & 4th quadrant
D. Only in the 1st quadrant
Answer» C. 1st & 4th quadrant
440.

 Power diode is __________

A. a three terminal semiconductor device
B. a two terminal semiconductor device
C. a four terminal semiconductor device
D. a three terminal analog device
Answer» C. a four terminal semiconductor device
441.

To make a signal diode suitable for high current & high voltage carrying applications with minimum losses, ________

A. a lightly doped n layer is grown between the two p & n layers
B. a heavily doped n layer is grown between the two p & n layers
C. a lightly doped p layer is grown between the two p & n layers
D. a heavily doped p layer is grown between the two p & n layers
Answer» B. a heavily doped n layer is grown between the two p & n layers
442.

An ideal power diode must have

A. low forward current carrying capacity
B. large reverse breakdown voltage
C. high ohmic junction resistance
D. high reverse recovery time
Answer» C. high ohmic junction resistance
443.

Which of the following is true in case of a forward biased p-n junction diode?

A. The positive terminal of the battery sucks electrons from the p-region
B. The positive terminal of the battery injects electrons into the p-region
C. The negative terminal of the battery sucks electrons from the p-region
D. None of the above mentioned statements are true
Answer» B. The positive terminal of the battery injects electrons into the p-region
444.

 Which of the following is true in case of an unbiased p-n junction diode?

A. Diffusion does not take place
B. Diffusion of electrons & holes goes on infinitely
C. There is zero electrical potential across the junctions
D. Charges establish an electric field across the junctions
Answer» E.
445.

When a physical contact between a p-region & n-region is established which of the following is most likely to take place?

A. Electrons from N-region diffuse to P-region
B. Holes from P-region diffuse to N-region
C. Both of the above mentioned statements are true
D. Nothing will happen
Answer» D. Nothing will happen
446.

In the p & n regions of the p-n junction the _________ & the ___________ are the minority charge carriers respectively.

A. holes, holes
B. electrons, electrons
C. holes, electrons
D. electrons, holes
Answer» E.
447.

Which of the below mentioned statements is false regarding a p-n junction diode?

A. Diode are uncontrolled devices
B. Diodes are rectifying devices
C. Diodes are unidirectional devices
D. Diodes have three terminals
Answer» E.
448.

The n-region has a greater concentration of _________ as compared to the p-region in a P-N junction diode.a

A. holes
B. electrons
C. both holes & electrons
D. phonons
Answer» C. both holes & electrons
449.

 In the p & n regions of the p-n junction the _________ & the ___________ are the majority charge carriers respectively.

A. holes, holes
B. electrons, electrons
C. holes, electrons
D. holes, electrons
Answer» D. holes, electrons
450.

A p-type semiconductor material is doped with ____________ impurities whereas a n-type semiconductor material is doped with __________ impurities

A. acceptor, donor
B. acceptor, acceptor
C. donor, donor
D. donor, acceptor
Answer» B. acceptor, acceptor