Explore topic-wise MCQs in Embedded Systems.

This section includes 61 Mcqs, each offering curated multiple-choice questions to sharpen your Embedded Systems knowledge and support exam preparation. Choose a topic below to get started.

1.

What is the full form of MESI in Memory Systems?

A. modified exclusive stale invalid
B. modified exclusive shared invalid
C. modified exclusive system input
D. modifies embedded shared invalid
Answer» C. modified exclusive system input
2.

What are the basic elements required for cache operation?

A. memory array, multivibrator, counter
B. memory array, comparator, counter
C. memory array, trigger circuit, a comparator
D. memory array, comparator, CPU
Answer» C. memory array, trigger circuit, a comparator
3.

Which configuration of memory organisation replaces By 1 organisation?

A. by 4 organisation
B. by 8 organisation
C. by 9 organisation
D. by 16 organisation
Answer» B. by 8 organisation
4.

Which is the early form of non-volatile memory?

A. magnetic core memory
B. ferrimagnetic memory
C. anti-magnetic memory
D. anti-ferromagnetic
Answer» B. ferrimagnetic memory
5.

Which are the two main types of processor connection to the motherboard?

A. sockets and slots
B. sockets and pins
C. slots and pins
D. pins and ports
Answer» B. sockets and pins
6.

What is the disadvantage of the physical address?

A. debugging
B. delay
C. data preservation
D. data cleared
Answer» C. data preservation
7.

Which of the following address is seen by the memory unit?

A. logical address
B. physical address
C. virtual address
D. memory address
Answer» C. virtual address
8.

Which of the following memories has more speed in accessing data?

A. SRAM
B. DRAM
C. EPROM
D. EEPROM
Answer» B. DRAM
9.

What happens when a task attempts to access memory outside its own address space?

A. paging fault
B. segmentation fault
C. wait
D. remains unchanged
Answer» C. wait
10.

Which factor determines the cache performance?

A. software
B. peripheral
C. input
D. output
Answer» B. peripheral
11.

What is the full form of GDTR in Memory Systems?

A. global descriptor table register
B. granularity descriptor table register
C. gate register
D. global direct table register
Answer» B. granularity descriptor table register
12.

What leads to the development of MESI and MEI protocol?

A. cache size
B. cache coherency
C. bus snooping
D. number of caches
Answer» C. bus snooping
13.

Which of the following is serial access memory?

A. RAM
B. Flash memory
C. Shifters
D. ROM
Answer» D. ROM
14.

Which of the memory organisation is widely used in parity bit?

A. by 1 organisation
B. by 4 organisation
C. by 8 organisation
D. by 9 organisation
Answer» B. by 4 organisation
15.

The modified bit is also known as

A. dead bit
B. neat bit
C. dirty bit
D. invalid bit
Answer» D. invalid bit
16.

Which of the following support virtual memory?

A. segmentation
B. descriptor
C. selector
D. paging
Answer» E.
17.

Which of the following have a 16 Mbytes addressed range?

A. PowerPC
B. M68000
C. DSP56000
D. TMS 320
Answer» C. DSP56000
18.

What is the purpose of the address bus?

A. to provide data to and from the chip
B. to select a specified chip
C. to select a location within the memory chip
D. to select a read/write cycle
Answer» D. to select a read/write cycle
19.

What does PMMU stands for?

A. protection mode memory management unit
B. paged memory management unit
C. physical memory management unit
D. paged multiple management unit
Answer» C. physical memory management unit
20.

What does 'G' in the descriptor entry describe?

A. gain
B. granularity
C. gate voltage
D. global descriptor
Answer» C. gate voltage
21.

What is the full form of BEDO DRAM in Memory Systems?

A. burst EDO DRAM
B. buffer EDO DRAM
C. BIBO EDO DRAM
D. bilateral EDO DRAM
Answer» B. buffer EDO DRAM
22.

How many main signals are used with memory chips?

A. 2
B. 4
C. 6
D. 8
Answer» C. 6
23.

Which mode offers the banking of memory in the DRAM interfacing technique?

A. page mode
B. basic DRAM interfacing
C. page interleaving
D. burst mode
Answer» D. burst mode
24.

What is the full form of DMA in Memory Systems?

A. direct memory access
B. direct main access
C. data main access
D. data memory address
Answer» B. direct main access
25.

What type of cache is used in the Intel 80486DX?

A. logical
B. physical
C. harvard
D. unified
Answer» E.
26.

Which refresh technique is useful for low power consumption?

A. Software refresh
B. CBR
C. RAS
D. Burst refresh
Answer» C. RAS
27.

Who invented TriMedia processor?

A. Intel
B. IBM
C. Apple
D. NXP Semiconductor
Answer» E.
28.

What is the full form of TCR in Memory Systems?

A. temperature-compensated refresh
B. temperature-compensated recovery
C. texas CAS-RAS
D. temperature CAS-RAS
Answer» B. temperature-compensated recovery
29.

Which of the following is a Motorola's protocol product?

A. MCM62940
B. Avalon
C. Slave interfaces
D. AXI slave interfaces
Answer» B. Avalon
30.

Which is the very basic technique of refreshing DRAM?

A. refresh cycle
B. burst refresh
C. distributive refresh
D. software refresh
Answer» B. burst refresh
31.

What is the full form of SIMM in Memory Systems?

A. single in-line memory module
B. single interrupt memory module
C. single information memory module
D. same-in-line memory module
Answer» B. single interrupt memory module
32.

Why is SRAM more preferably in non-volatile memory?

A. low-cost
B. high-cost
C. low power consumption
D. transistor as a storage element
Answer» D. transistor as a storage element
33.

Which of the following have an 8 KB page?

A. DEC Alpha
B. ARM
C. VAX
D. PowerPC
Answer» B. ARM
34.

Which of the following uses a linear line fill interfacing?

A. MC68040
B. MC68030
C. US 74707 B2
D. Hyper Bus
Answer» C. US 74707 B2
35.

Which of the following uses a software refresh in the DRAM?

A. 8086
B. 80386
C. Pentium
D. Apple II personal computer
Answer» E.
36.

Which cache memory solve the cache coherency problem?

A. physical cache
B. logical cache
C. unified cache
D. harvard cache
Answer» B. logical cache
37.

In which memory, the signals are multiplexed?

A. DRAM
B. SRAM
C. EPROM
D. EEPROM
Answer» B. SRAM
38.

Which of the following has programmable hardware?

A. microcontroller
B. microprocessor
C. coprocessor
D. FPGA
Answer» E.
39.

What does DPL in the descriptor describes?

A. descriptor page level
B. descriptor privilege level
C. direct page level
D. direct page latch
Answer» C. direct page level
40.

What is the full form of MEI in Memory Systems?

A. modified embedded invalid
B. modified embedded input
C. modified exclusive invalid
D. modified exclusive input
Answer» D. modified exclusive input
41.

Which of the following is used to start a supervisor level?

A. error signal
B. default signal
C. wait for the signal
D. interrupt signal
Answer» B. default signal
42.

Which of the following is necessary for the address translation in the protected mode?

A. descriptor
B. paging
C. segmentation
D. memory
Answer» B. paging
43.

Which of the following has a fast page mode RAM?

A. burst mode
B. page interleaving
C. EDO memory
D. page mode
Answer» D. page mode
44.

How many types of tables are used by the processor in the protected mode?

A. 1
B. 2
C. 3
D. 4
Answer» C. 3
45.

Who has invented flash memory?

A. Dr.Fujio Masuoka
B. John Ellis
C. Josh Fisher
D. John Ruttenberg
Answer» B. John Ellis
46.

Which of the following mode of operation in the DRAM interfacing has a page boundary?

A. burst mode
B. EDO RAM
C. page mode
D. page interleaving
Answer» D. page interleaving
47.

Which of the following uses a bus snooping mechanism?

A. MC88100
B. 8086
C. 8051
D. 80286
Answer» B. 8086
48.

Which of the following is also known as Illinois protocol?

A. MESI protocol
B. MEI protocol
C. Bus snooping
D. Modified exclusive invalid
Answer» B. MEI protocol
49.

Which package has high memory speed and change in the supply?

A. DIP
B. SIMM
C. DIMM
D. zig-zag
Answer» D. zig-zag
50.

Which of the following consist two lines of legs on both sides of a plastic or ceramic body?

A. SIMM
B. DIMM
C. Zig-zag
D. Dual in-line
Answer» E.