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This section includes 13 Mcqs, each offering curated multiple-choice questions to sharpen your Mechanical Behaviour knowledge and support exam preparation. Choose a topic below to get started.
1. |
A vacancy is a must for self-diffusion. |
A. | True |
B. | False |
Answer» B. False | |
2. |
Climb of edge dislocation is a chief recovery in FCC metals. |
A. | True |
B. | False |
Answer» C. | |
3. |
Decreasing creep rate in transient creep is because of _________ dislocation density. |
A. | Increased |
B. | Decreased |
C. | Zero |
D. | Locked |
Answer» B. Decreased | |
4. |
Decreasing creep rate during __________ arises from increasing dislocation density. |
A. | Secondary creep |
B. | Viscous creep |
C. | Transient creep |
D. | Tertiary creep |
Answer» D. Tertiary creep | |
5. |
Why does creep rate decrease with time at a low temperature? |
A. | Vacancy movement |
B. | Activation energy unavailable |
C. | Dislocation movement |
D. | Kinetic energy low |
Answer» C. Dislocation movement | |
6. |
At lower temperatures creep rate _________ with time. |
A. | Increases |
B. | Decreases |
C. | Remains constant |
D. | First increases, then decrease |
Answer» C. Remains constant | |
7. |
The transient creep described mathematically by _________ is expressed logarithmically by _________ |
A. | Andrade, Manson |
B. | Andrade, Cottrell |
C. | Coffin, Manson |
D. | W.A. Wood, Orowan |
Answer» C. Coffin, Manson | |
8. |
What are the predominant recovery processes? |
A. | Cross slip of screw dislocations |
B. | Cross slip of edge dislocations |
C. | Climbing of screw dislocations |
D. | Climbing of edge dislocations |
Answer» B. Cross slip of edge dislocations | |
9. |
Creep rate according to Cottrell equation depends on the activation energy to move ______ |
A. | Dislocations |
B. | Jogs |
C. | Kinks |
D. | Solute atoms |
Answer» B. Jogs | |
10. |
When material under stress is heated, creep rate ______ with time. |
A. | Increases |
B. | Decreases |
C. | Remains constant |
D. | First increases, then decrease |
Answer» B. Decreases | |
11. |
The stress that a material can withstand for a specified period of time without excessive deformation at higher temperature is ______ |
A. | Fatigue strength |
B. | Creep strength |
C. | Tensile strength |
D. | Yield strength |
Answer» C. Tensile strength | |
12. |
What is the predominant process below 0.5 Tm? |
A. | Viscous creep |
B. | Tertiary stage |
C. | Secondary stage |
D. | Transient creep |
Answer» E. | |
13. |
At lower temperature (below 0.3 Tm), what causes creep phenomenon? |
A. | Diffusion process |
B. | Diffusion less process |
C. | Recrystallization |
D. | Softening |
Answer» C. Recrystallization | |