Silicon dioxide etch rate at 90 °C using 30 % KOH is approximately ______________$

• A. 1 ¬¨¬®¬¨¬µm/hr
• B. 5 ¬¨¬®¬¨¬µm/hr
• C. 10 ¬¨¬®¬¨¬µm/hr
• D. 100 ¬¨¬®¬¨¬µm/hr