1.

In the silver plating of copper, \[K[Ag{{(CN)}_{2}}]\] is used instead of \[AgN{{O}_{3}}\]. The reason is

A. a thin layer of Ag is formed on Cu
B. more voltage is required
C. \[A{{g}^{+}}\] ions are completely removed from solution
D. less availability of \[A{{g}^{+}}\] ions, as Cu cannot displace Ag from \[{{[Ag{{\left( CN \right)}_{2}}]}^{-}}\] ion
Answer» E.


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