

MCQOPTIONS
Saved Bookmarks
1. |
In the silver plating of copper, \[K[Ag{{(CN)}_{2}}]\] is used instead of \[AgN{{O}_{3}}\]. The reason is |
A. | a thin layer of Ag is formed on Cu |
B. | more voltage is required |
C. | \[A{{g}^{+}}\] ions are completely removed from solution |
D. | less availability of \[A{{g}^{+}}\] ions, as Cu cannot displace Ag from \[{{[Ag{{\left( CN \right)}_{2}}]}^{-}}\] ion |
Answer» E. | |