

MCQOPTIONS
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1. |
Etching rate can be improved by_____ |
A. | lowering the temperature |
B. | using less active oxidant and highly active etchant |
C. | increasing the number of electronic holes |
D. | reducing the surface area of the pores so that less time will be required for the etching |
Answer» D. reducing the surface area of the pores so that less time will be required for the etching | |