MCQOPTIONS
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| 1. |
Etching rate can be improved by_____ |
| A. | lowering the temperature |
| B. | using less active oxidant and highly active etchant |
| C. | increasing the number of electronic holes |
| D. | reducing the surface area of the pores so that less time will be required for the etching |
| Answer» D. reducing the surface area of the pores so that less time will be required for the etching | |